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First Mux/Demux Chips for 112Gb/s OOK Modulation Among a Dozen New 100G Components Announced at OFC 2009

Building on its leadership in ultrafast 100G silicon, Micram has announced an impressive set of new components at  Optical Fiber Conference 2009 in San Diego, including the first silicon supporting the On-Off Keying (OOK) modulation scheme.

“Our goal in 100G is to give optical communications visionaries the tools they need to bring their ideas to life as quickly as possible,” said Matthias Tom Frei, CEO of Micram. “Our latest range of components greatly expands what aggressive developers can achieve over the next 12 to 18 months. In particular, we are announcing the first silicon supporting OOK, an important electrical modulation scheme that Micram is taking from the theoretical to the practical with our new 112G Mux/Demux chips.”

In its new range of silicon, Micram provides several varied multiplexer, demultiplexer and MSDFF components supporting the 30 Gb/s and 60 Gb/s speed ranges. The MX4130F 4:1 Mux breaks new ground by providing a FPGA control layer, enabling very high speed data streams to be generated by off-the-shelf FPGAs from Xilinx and Altera.

For details of our 8 New 100G Development Chips click here.

Also new from Micram are a series of single and quad transimpedance amplifiers (TIA) supporting both 3.3V and 5.2V applications, as well as a clock distribution module and frequency divider chip.