Micram

No matter whether detailed investigations on engineering samples or final high volume module test of the packaged chip assembly - Micram provides the adequate solution for any challenge. Throughout the engineering phase until production release of the module, there are various kinds of tasks to cope with. Some examples are:

• package evaluation (impact of package on performance),
• characterization of the module (performance under various conditions),
• functionality & performance test in the application (system level evaluation),
• root cause of error analysis.

These engineering tasks are carried out as a part of our in-house service which yields quick results especially in conjunction with the complementary Rapid!Prototyping and Measurement services. Detailed information on this is provided in the Test&Measurement section.

For high volume production, Micram supplies module test via industrial partners, either in conjunction with foundry and assembly or as a standalone service. Benefits of Micram module test are:

• high synergy level with wafer level test thanks to common test development and establishment
• failure analysis and corrective action plan,
• yield assessment and improvement strategy,
• scheduling and monitoring throughout entire test,
• harmonized design, test and assembly requirements,
• reliability tests and qualification.

Needless to say that all services are individually tailored to our customers' requirements and follow the objective to offer the best solution in terms of test cost, test coverage, and performance monitoring.

Micram module test services are available in conjunction with any Micram turnkey ASIC development as well as with Rapid!Prototyping services. For support of separate complementary module test service, contact your Micram sales representative.

Further information can be found in our article:
"Low Volume Wafer and Module Level Test Implementation at Micram"