Micram

Driven by the ongoing progress in semiconductor and ASIC development, microelectronic packaging has become of major importance for the performance of the chip assembly unit.

Electrical effects due to package parasitics and properties such as noise immunity, cross talk, ground bounce, stability, reflections, mismatch, signal damping, ringing dispersion, but also thermal, mechanical and reliability issues are vital opponents in the obtain performance game. In order to win the match, package selection, design and modelling shall take place in conjunction with the ASIC design. This enables the designers of both, package and ASIC, to match corresponding properties for best performance.

In spite of those technical challenges, package type and technology as well as related assembly and test shall not be oversized in order to support competitive product pricing.

Package design is only one part of Micram's comprehensive services around assembly, which provide turnkey solutions beginning from package selection up to product delivery. For more detailed informations on the benefits of Micram's assembly services and solutions, please click here.