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Wafer Test

MICRAM services provide customized test and measurement solutions on wafer level. Depending on the wafer status, services are performed in-house or by dedicated industrial partners.

Throughout the engineering phase detailed investigations as well as low volume functionality and at-speed tests are quickly carried out as a part of our in-house service. Detailed information is provided in the wafer level section of Test&Measurement services.

For high volume production, Micram supplies wafer test via industrial partners, either in conjunction with foundry and assembly or as a standalone service. Benefits of Micram wafer test are:

  • test development and establishment,
  • failure analysis and corrective action plan,
  • yield assessment and improvement strategy,
  • scheduling and monitoring throughout entire test,
  • harmonized design, test and assembly requirements.

MICRAM test strategies like

  • low speed tester with plain interfacing loadboard,
  • low speed tester with at-speed BIST functionality,
  • low speed tester with speed translating (upgrading) loadboard circuitry,
  • low/high speed tester with at-speed capability and membrane card,

are individually tailored to our customers' requirements and follow the objective to offer the best solution in terms of test cost, test coverage, and performance monitoring.

Micram wafer test services are available in conjunction with any Micram turnkey ASIC development as well as with Rapid!Prototyping services. For support of separate complementary wafer test service, please contact your Micram sales representative.

Also read our article:
"Low Volume Wafer and Module Level Test Implementation at MICRAM"