Process Options
- Standard wet etch process with optimized properties yields:
- fast processing,
- line width and spacing below 50 microns,
- well defined rectangular line shapes,
- line impedance control.
- Edge metallization with arbitrary shapes yields high performance ground contacts to the substrate backside (e.g. in the substrate recess for the chip insert):
- excellent common mode noise performance for low ground bounce,
- excellent RF performance supported by short current return path,
- high I/O density, no additional Vcc lines required.
- Recess chip assembly yields:
- low bond inductance by short, flat bond wires,
- low inductance, high current contact plane by edge metallization surrounding the chip.
- High power, thermally enhanced conductive/isolated chip assembly ensures:
- highest chip performance by low junction temperatures,
- thermal control by direct access of chip backside.
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