Micram

Conventional functional test on wafer level is used for preselection of good dies. This kind of test, usually applied in production at high volumes is provided by Micram via industrial partner services.

Wafer level services at Micram focus on the time critical engineering phase of wafer and die, which requires highest flexibility in measurement setup. During that period, measurement and test (probing) on wafer or bare die level is a fast and straightforward way to interact with the chip. All pads are directly accessible and probing configurations can be changed on the fly depending on the actual needs. Besides pure functional verification, especially at-speed measurements (currently up to 65 GHz) are a valuable aid for verification, characterization or deembedding of the plain chip performance.  As a benefit, time and cost for the assembly process can be saved or spent after successful wafer/die level measurements.

For advanced root cause of error analysis, even probing on metallization and lines of the chip wiring is possible by special measures. For modifications, ultrasonic cutting of the chip wiring can be performed even in conjunction with the ongoing measurements. Complementary laser and FIB options are accessible via industrial partner services.

Benefits of Micram wafer/die level services at a glance:

All wafer level services performed in a clean room (class 10,000).

• Functionality test (probe card or positioners).
• Preselection, screening.
• At-speed test, verification, characterization (membrane/pyramid or RF probes).
• Deembedded measurements of the plain chip without assembly.
• Error analysis, e.g. probing on / cutting of metallizations and lines.
• Probing on pads which are not accessible with assembled chips.
• Probing on pre or post assembled bare dies.