Print
Test & Measurement Home
Capability
Wafer Level
Interfacing & Fixturing
Modeling
Complete Article

Interfacing and Fixturing

In order to verify proper device operation and to measure/characterize performance under application conditions, a method must exist to interface the measurement equipment to the device under test. Depending on the application, there is a wide variety of requirements for this interface.

Some examples are:

  • Support of large number of signals.
  • High frequency and/or wide bandwidth.
  • High current densities (e.g. well defined and low supply voltage drop).
  • DC decoupling.
  • RF signal blocking.
  • Well known modeled properties, which can be considered in resimulations.
  • Deembedding/calibration capability.
  • Quick adoption/optimization capability according to measurement results.
  • Thermal interface with adequate, defined properties.
  • Probing capability (wafer prober) for RF and DC signals.
  • Standard or modularized fixtures, e.g. for recurring measurements.

Interfacing and fixturing for Test&Measurement are provided by -Micram Rapid!Prototyping services. For a detailed description and examples of this comprehensive service, please refer to the related Rapid!Prototyping section or contact your Micram sales representative.